SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility

The facility, at the Purdue Research Park in West Lafayette, is scheduled to begin cleanroom operations in the second half of 2028, according to SK Hynix's website and press statements. The site will house a next-generation high-bandwidth memory (HBM) packaging line as well as an AI semiconductor research and development facility.

Source: The Economic Times27 August 2026 at 7:41 pm ISTrss

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Original headline: SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility
Product category: computing
Curation state: ingested