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Xiaomi 18 Fold First Look at IFA 2026 with XRING 03 chip and Leica cameras

Earlier today at IFA 2026 in Berlin, Xiaomi showed off its upcoming foldable – Xiaomi 18 Fold, as the first flagship with its in-house XRING03 silicon. The Fold 18 is also going to feature Leica imaging for the camera tech.

Source: FoneArenarss
Read the original at FoneArena

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Xiaomi 18 Fold First Look at IFA 2026 with XRING 03 chip and Leica cameras
Product category
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